MKP184K275V

MKP184K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP154K275V

MKP154K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP124K275V

MKP124K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP104K275V

MKP104K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP823K275V

MKP823K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP683K275V

MKP683K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP563K275V

MKP563K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP473K275V

MKP473K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP393K275V

MKP393K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy

MKP363K275V

MKP363K275V
X2-MKP为无感结构,用金属化聚丙烯膜作为电介质/电极卷绕而成,导线采用镀锡铜包钢线,使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy