日期: 2026年6月26日

MKP184K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP154K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP124K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP104K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP823K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP683K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP563K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP473K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP393K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP363K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.